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Corrosion properties of soldered joints. Part I: Electrochemical action of dental solder and dental nickel-chromium alloy.

The corrosion properties of contact between six Ni-Cr alloys and two dental solders were evaluated. Ni-Cr alloys with low Cr content coupled with silver solder induced continuous galvanic current, whereas Ni-Cr alloys with high Cr and some Mo content coupled with silver or gold solder induced galvanic current for a short time. Six Ni-Cr alloys were divided into two groups according to the dissolution of Ni, one with low resistance and the other with high resistance. The initial equilibrium was induced between high resistance Ni-Cr alloys and both solders by less current density, which implies a smaller degree of corrosive current than that in low-resistance alloys. Corrosion was observed in the silver solder coupled with high-resistance Ni-Cr alloy, but was not found in the gold solder coupled with both alloys. In soldering Ni-Cr alloy, it is better to use a gold solder and a high-resistance Ni-Cr alloy for corrosion resistance.

Chromium↗

Corrosion properties of soldered joints. Part II: Corrosion pattern of dental solder and dental nickel-chromium alloy.

Six nickel-chromium (Ni-Cr) alloys joined with two solders were evaluated for degree of corrosion after they were immersed in corrosive solution for 100 days. The corroded surface of the Ni-Cr alloy and the cross section of the soldered joint were observed and the solution of nickel and copper (Cu) ions in each combination was measured. No corrosion was observed in the high-resistant Ni-Cr alloys with high Cr content. Pitting corrosion was seen on low-resistant Ni-Cr alloys, which had less Cr content. In the cross section of the joint, the joint of silver solder became porous by corrosion and the corrosion advanced especially along the interface. Solution of Ni ions was detected in all of the combinations of Ni-Cr alloys and solders with exception of the combination of high-resistant Ni-Cr alloys and gold solder. On the other hand, solution of Cu ions was detected in all of the combinations with silver solder.

Chromium↗

An investigation of tensile strength of dental solder joints.

Tensile specimens of dental solder joints were tested to determine the effect of gap distance on the strength of solder joints. Two dental alloys were used; a Type III gold alloy and a gold-palladium (Au-Pd) alloy. The Type III alloy was joined with the recommended gold solder. The Au-Pd alloy was joined using preceramic and postceramic application soldering techniques. Gap distances of 0.13 mm, 0.5 mm, and 1 mm were used with each soldering technique. All solder specimens were machined to a uniform diameter and then tested for tensile strength. It was concluded that: 1. There was a significant increase in strength for the Type III gold as the gap distance was increased. 2. The trend toward stronger joints at narrow gap distances for Au-Pd alloy joined with presolder was not statistically significant. 3. The trend toward stronger joints at wide gap distances for the Au-Pd alloy joined with the postsolder was not statistically significant. 4. The postsolder joints were statistically stronger than the presolder joints. 5. The trends observed could be partially explained in terms of competing effects of yield strength (triaxially), wettability, and void or inclusion content at the various gap distances.

Dental Alloys↗

Cytotoxicity of Au-based dental solders alone and on a substrate alloy.

Gold-based dental solders are commonly combined with a substrate alloy in dental prostheses and are in long-term intimate contact with oral tissues, yet the biological properties of dental solders are almost unknown. Previous studies have shown that combinations of dissimilar alloys may increase the risk of elemental release and adverse biological effects. The purpose of the current study was to measure the cytotoxicity of dental solders alone and in combination with a substrate metal. Based on previous reports, which measured the cytotoxicity of combinations of dissimilar alloys, we hypothesized that the cytotoxicity of solder-substrate combinations cannot be predicted based on the cytotoxicity of the solders alone. Specimens of 13 high-noble (Au >/= 40 wt%; Au+Pt+Pd >/= 60%) and 6 noble (Au+Pt+Pd >/= 25 wt%) solders were made either in bulk or in combination with a compatible Au-Pd substrate alloy. The results showed that, most often, solder-substrate combinations were less toxic than the solders alone, but three high-noble solders were more cytotoxic in combination. We concluded that, when screening new Au-based dental solders for cytotoxicity, the solder should be assessed in combination with a clinically relevant substrate alloy.

Alloys↗

Distortion in dental soldering as affected by gap distance.

In identifying the criteria which influence soldering distortion, the results of this study indicate the following: 1. Linear distortion identified at the investment phase (a net increase in gap distance) is due to setting expansion of the plaster and soldering investment. 2. The linear distortion identified at the soldering phase (a net decrease in gap distance) occurs because of the contraction of the solder. 3. The rotational distortions measured were found to be minimal. 4. The use of a minimum gap distance, without contact, is desirable. 5. Adding solder results in a well-rounded, solid solder joint.

Crowns↗

[The dental soldering by means of high frequency induction heating (author's transl)].

The authors examined the methods of high frequency induction soldering, especially Loop-method, other than the gas flame soldering which was known generally. The details which was done are: (1) about the form of induction coil, and the relative places of the coil and restrative appliance, and some supplementary appliances of them. (2) about strength of soldered joints of Co-Cr wire using silver solder and Pd-solder, and observation on the corrosion of soldered-joints by the scanning electron-microscope. (3) about the comparison of the characteristics of Co-Cr wire by means of high-frequency induction heating and gas-flame one. (4) about the examples of soldering of porcelain crown-bridge and clasp wire attached on the dental cast, and possibility of soldering techniques of them on the dental cast. The authors found that the high frequency induction method was preeminent from the other method on the point of (a) the characteristic of heated wire, (b) the strength of soldered joints, (c) the easiness of operating of them, and (d) the possibility of soldering using the high-melting point of Pd-solder, and the soldering of them on the dental cast. Therefore we can enough respect the application on the dental area of this apparatus and this techniques of the high-frequency induction soldering.

Chromium Alloys↗