[Convolvulus resin as a substitute for jalap resin].
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Adhesion of 4-META to Au-In alloy was improved by adding In equivalent to .15% of Au content. On the basis of the results of Au-In alloys analyzed by XPS, the present study investigated the reason why adhesion of the Au-In alloy was improved. The O 1s spectrum could be separated into three oxygen chemical states, In2O3, chemisorbed H2O, and physisorbed H2O. The amount of chemisorbed H2O decreased remarkably with increasing amount of In. It is considered that the poor adhesive ability of the pure gold and alloys containing only small amounts of In was due to the chemisorbed H2O molecules and insufficient indium oxide on the alloy surface. It was established that excellent adhesion requires an oxide with chemical affinity for 4-META to cover at least 50% of the alloy surface.
This study evaluated the oxide characteristics on a Ag-Sn particle surface modified by acid and heat in order to understand the bonding mechanism. Nine different Ag-Sn particles including standard Sn, SnO and SnO2 were evaluated by X-ray Photoelectron Spectroscopy (XPS). The particles were also used for preparing the composite to test the flexural properties following the ISO 4049. A high correlation between flexural strength of the composites and Sn3d binding energy of their filler particles was found. Different oxide forms (SnO and SnO2) showed different adhesive abilities to bond with 4-META, regarding the difference in flexural strength of the composite. The highest flexural strength composite showed Sn3d binding energy of its filler at 486.4 eV, which was the SnO binding area. This implies that SnO was responsible for a good bond between particle surface and 4-META coupling agent.
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