Search PubMed⌕ Search
Home/Archive/PubMed

PubMed · 1300153

A simple method for handling grids.

M A Gorycki
View original source ↗Export metadata ↓

Abstract

A simple method for handling electron microscope grids is described here. While assuring their identification and safety, this method provides improved handling, temporary storage, and identification of grids bearing ultra-thin sections, and in addition, provides a novel method for preparing bulk samples. Grids are attached at their edges to the weakly adhesive surface of a "Post-it" note pad which sits in a petri dish. The grids are safely immobilized on the pad, classified based on their location, and identified by convenient pad notation. Grid manipulation and identification are simplified using this device, which is easily assembled from readily available and inexpensive materials.

Explore related subjects

Microscopy, ElectronSpecimen HandlingJournal Article

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

M A Gorycki. 1992. A simple method for handling grids.. https://doi.org/10.3109/10520299209110041

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related citations

PubMed1997

Influence of material properties on TEM specimen preparation of thin films.

Several factors must be taken into account when deciding which specimen preparation technique(s) to use. These factors include the amount of material available, ease of preparing this material due to its properties and familiarity, location and size of the region of interest, amount of information sought, facilities accessible, and time available by the researcher to devote to the preparation of the specimen. The more popular specimen preparations for thin films, namely, electropolishing, cleaving, crushing, mechanical thinning followed by ion milling, and ultramicrotomy are discussed and the more unusual techniques such as extraction/replication, photochemical etching, lithography and reactive ion etching (RIE), chemically assisted ion beam etching (CAIBE), and precision polishing-based techniques are described. Their advantages and disadvantages in the context of the above factors are discussed. Suggestions for increasing one's success rate in preparing specimens are given. The role of transmission electron microscopy (TEM) analysis is considered since it rarely stands in isolation from other physical analytical techniques, nor is it often used as a quick diagnostic tool. Conservation of material by the minimization of the amount of material used (or destroyed) by TEM specimen preparation, and conservation of one's time by performing TEM analysis only on "worthy" samples should be given maximum consideration.

Microscopy, Electron↗
PubMed1997

Preparation of cross-sectional TEM samples for low-angle ion milling.

The ideal ion-milled transmission electron microscope (TEM) sample would contain large, thin areas in selected regions, minimal top and bottom surface amorphization, and minimal preferential etching of adjacent materials. This desire has led to studies of these effects and improvements in designs and techniques for ion mills. Minimizing the incident angle of the ion beam to the surface of the sample has been found to be one of the most effective techniques for fulfilling these requirements. A new generation of ion mills has recently been designed to allow low-angle ion milling for the production of very high quality cross-sectional TEM samples. To take advantage of the low-angle ion milling capabilities and high-powered ion sources in these mills, new sample preparation techniques are required. In this paper, a simple technique of mounting material in a specialized titanium grid for cross-sectional TEM sample preparation is presented. This technique is designed to take full advantage of the powerful capabilities of these new low-angle ion mills.

Microscopy, Electron↗
PubMed1997

Cross-section TEM sample preparation of multilayer and poorly adhering films.

The preparation of TEM cross-section samples from multilayer films or poorly adhering films is discussed in detail in a step-by-step approach designed to enable a competent experimentalist to reproduce the technique. The samples are mounted on an aperture grid and mechanically polished to 2-3 microns in thickness. After ion beam milling for a short period of time (less than 1 hour), a large electron transparent area is obtained. Examples from several thin film systems are discussed.

Microscopy, Electron↗