PubMed · 11572505
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E J Swift. 2001. Dentin bonding.. https://doi.org/10.1111/j.1708-8240.2001.tb00267.x
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OBJECTIVES: The submicron hiatus represents a potential space between the base of the collagen network and the mineralized dentin when dentin is acid-etched for bonding. These spaces were observed in SEM studies after acid-etched dentin specimens were critical point dried or dehydrated in hexamethyldisilasane. However, they have never been identified in TEM studies of dentin hybrid layers. This study critically examined the cause of submicron hiati formation using a silver staining technique to measure nanoleakage. METHODS: Two multi-step, total-etch adhesives (One-Step, Bisco; Single Bond, 3M) and two single-step, self-etching adhesives (Prompt L-Pop, ESPE; One-Up Bond F, Tokuyama) were examined. Flat dentin surfaces were bonded with these adhesives and a lining composite. In each adhesive group, 0.8mm thick slabs from the same bonded tooth were coated with nail varnish applied 1mm from the bonded interfaces. The varnish was either left to dry completely for 10min before immersing in 50wt% silver nitrate (AgNO(3)) for 24h (group D), or painted on blotted tooth slabs that were immediately dropped into the AgNO(3) solution (group M). After developing, undemineralized, unstained, epoxy resin-embedded sections were prepared for transmission electron microscopy (TEM) to identify the amount and distribution of silver uptake. RESULTS: Nanoleakage patterns were observed in all adhesive-bonded teeth, regardless of brand. Fine reticular silver deposits were also found in the underlying undemineralized dentin. In group D, submicron hiati were seen as tunnels of heavy silver deposits beneath hybrid layers. Specifically, a hiatus occurred between the undemineralized intertubular dentin and a cohesively fractured layer of the same matrix that was attached to the base of the hybrid layer. Hiati were completely absent in group M, regardless of the brand of adhesive. SIGNIFICANCE: Submicron hiati are artifacts created by desiccation during specimen processing, and should be referred to as such in future studies of bonded dentin interfaces.
OBJECTIVES: The objectives of this experiment were to determine whether various transition metal salts in 37% o-phosphoric acid could both activate and etch an enamel surface prior to the use of an anaerobic adhesive. METHOD: Stainless steel attachments were bonded to human enamel using an anaerobic adhesive. In each case, the enamel was etched and activated using a solution of 37% o-phosphoric acid containing various transition metal sulfates and chlorides. After bench curing, the specimens were shear bond tested to failure and the load at debond recorded in each case. RESULTS: The results were analyzed using mean force to debond (N) and 95% confidence intervals. Kaplan-Meier survival probabilities and log-rank tests were also performed.Conclusions. Under the conditions of this experiment, the sulfate and chloride of copper in acid were the most effective etching/activating solutions. There was no significant difference in the mean force to debond between the copper (II) sulfate and copper (II) chloride. The chloride in acid was, however, the only one of the two to produce a conventional etch pattern on the surface of the enamel. SIGNIFICANCE: It is possible to render the enamel surface both retentive and active towards anaerobic adhesives, such that relatively unreactive substrates can be bonded to enamel using such adhesives.
OBJECTIVES: A previous study demonstrated that N-acryloyl aspartic acid (N-AAsp) aqueous solution is useful as a self-etching primer for dentin adhesion. The purpose of this study was to evaluate whether N-AAsp solution can be used for enamel etching, when compared with phosphoric acid. METHODS: N-AAsp was synthesized by the reaction of DL-aspartic acid and acryloyl chloride. The experimental self-etching primers were prepared by dissolving N-AAsp in water at various concentrations up to 20 wt%. The tensile bond strength of resin to bovine enamel was measured after the enamel was treated with the N-AAsp primers. The 40 wt% H(3)PO(4) was used for comparison. The treated enamel surfaces and the resin-enamel interfaces were also observed with a scanning electron microscope. RESULTS: The tensile bond strength to enamel increased linearly with the increasing N-AAsp concentration and reached the same value as that to enamel etched with 40 wt% H(3)PO(4) when N-AAsp concentration was 20 wt%, even though the etching ability of 20 wt% N-AAsp was inferior to 40 wt% H(3)PO(4). Regardless of the concentration of N-AAsp, the bond strength to enamel was the same as that to dentin reported in our previous study. SIGNIFICANCE: The 20 wt% N-AAsp aqueous solution showed enamel bonding equivalent to 40 wt% H(3)PO(4) in addition to the advantage of eliminating the rinse step with water. Based on the results obtained in this study along with those obtained in a previous study, it was concluded that 20 wt% N-AAsp aqueous solution is a promising self-etching primer to simultaneously treat enamel and dentin.