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William R Childs

Publications and source records attributed to William R Childs.

3 recordsLinked to original sources

Masterless soft lithography: patterning UV/ozone-induced adhesion on poly(dimethylsiloxane) surfaces.

A novel microreactor-based photomask capable of effecting high resolution, large area patterning of UV/ozone (UVO) treatments of poly(dimethylsiloxane) (PDMS) surfaces is described. This tool forms the basis of two new soft lithographic patterning techniques that significantly extend the design rules of decal transfer lithography (DTL). The first technique, photodefined cohesive mechanical failure, fuses the design rules of photolithography with the contact-based adhesive transfer of PDMS in DTL. In a second powerful variation, the UVO masks described in this work enable a masterless soft lithographic patterning process. This latter method, UVO-patterned adhesive transfer, allows the direct transfer of PDMS-based polymer microstructures from a slab of polymer to silicon and other material surfaces. Both methods exploit the improved process qualities that result from the use of a deuterium discharge lamp to affect the UVO treatment to pattern complex, large area PDMS patterns with limiting feature sizes extending well below 1 microm (> or = 0.3 microm). The use of these structures as resists is demonstrated for the patterning of metal thin films. A time-of-flight secondary ion mass spectroscopy study of the process provides new insights into the mechanisms that contribute to the chemistry responsible for the interfacial adhesion of DTL transfers.

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Large-area patterning of coinage-metal thin films using decal transfer lithography.

We describe two new procedures that appear to hold significant promise as means for patterning thin-film microstructures of the coinage metals (Cu, Ag, Au). A feature central to both is the modification of their surfaces to promote the adhesive transfer of PDMS thin-film microstructures, a material suitable for use as resist layers in large-area patterning, using Decal Transfer Lithography (DTL). The present work provides a significant extension of the capabilities of DTL patterning, providing general protocols that can be used to transfer decal resists to essentially any substrate surface. The first method involves the functionalization of a surface, specifically those of gold and silver films with a thiol-terminated silane coupling agent, (mercaptopropyl)trimethoxysilane. This self-assembled monolayer, when hydrolyzed to its silanol form, provides a robust adhesion-promoting layer suitable for use in DTL patterning. The second method exploits the surface chemistry provided by the deposition of a nanoscale silicon dioxide thin-film capping layer using e-beam evaporation. This procedure provides an exceptional method for patterning large-area, thin-film microstructures of Cu-one compatible with micrometer-scale design rules-that are essentially defect free. Both surface modification strategies enable high-quality poly(dimethylsiloxane) decal transfers, and as the current work shows, these structures are suitable for large-area micrometer-sized patterning of gold, silver, and copper thin films via both wet-etching and lift-off procedures.

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Decal transfer microlithography: a new soft-lithographic patterning method.

A new soft-lithographic method for micropatterning polymeric resists, Decal Transfer Microlithography (DTM), is described. This technique is based on the transfer of elastomeric decal patterns via the engineered adhesion and release properties of a compliant poly(dimethylsiloxane) (PDMS) patterning tool. An important feature of the DTM method is the exceptionally broad spectrum of design rules that it embraces. This procedure is capable of transferring micron to submicron-sized features with high fidelity over large substrate areas and potentially simplifies to a significant degree the requirements for effecting multiple levels of registration. The DTM method offers some potential advantages over other soft-lithographic patterning methods in that it is amenable to transferring resist patterns with both open and closed forms, negative and positive image contrasts, and does so for a wide variety of aspect ratios and a significant range of pattern pitches that can be accommodated without degradation due to mechanical distortions of the pattern transfer tool. The most significant advance embodied in the DTM method, however, is that it offers useful new capabilities for the design and fabrication of advanced planar and 3D microfluidic assemblies and microreactors.

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